SuperClean™ 1600-55
• Reduces DI water use up to 80%
• Reduces overall defect density
• PVDF and PP tank materials
• 300mm and smaller wafers
• Post-sulfuric, post-phosphoric, post-SC-2, and other post-acid rinse applications
• Transducer can be removed and replaced in the field
• Front-loading, on-axis design
• Single cassette capacity up to 150mm wafers
• Easily integrated into fully- automated and manual
• Production environments
• Available in several single-unit or double-stack configurations with standard or bay and chase cabinets
• Footswitch automatically opens door for easy loading
• S2-93and CE compliant
• The drying performance standard in many of the world’s most advanced sub-micron fabs
• Patented non-contact, nitrogen labyrinth seal
• 316 stainless-steel bowl
• Available RA-10finish bowl
• All-PFA plumbing, fittings, valves
• Strategically located spray nozzles
• Accurate rpm control to ±4rpm
• Low to neutral particle adders ≤0.15µm
• Few mechanics for high MTBF and uptime
• Precision indexing allows reliable end-effector cassette interfacing
• ESD “hardened,” SECS-II compatible controller
• Sensors for door open, closed, and obstructed; rotor indexed; N2 flow, N2 pressure, and more
• Remote keypad and controls
• Quick-release and unobstructive housing designs allow for fast and easy service access
Processes
Rinse and dry steps following:
• Pre-Diffusion Clean, SC-1 Clean, SC-2 Clean
• Monitor Wafer Clean, Post-laserscribe Clean
• Post-Silicon-Polish Clean, Post-CMP Clean
• Pre-Epi / Post-Epi Deposition Cleans
• Post-Poly Deposition Clean, Post-Silicon-Etch Clean
• Nitride Strip, Titanium Strip, DHPH Etch
• Solvent Cleans, Pre-Silicide Clean
• Backside CVD Clean, Resist Strip
Substrates
• Silicon wafers, thin wafers
• GaAs wafers
• Silicon Carbide
• Hard disks
• Masks, Glass, and more